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Process Development Team Memory Division Semiconductor Business Samsung Electronics Co. Ltd. | 論文
- Risk-Adapted Preemptive Therapy for Cytomegalovirus Disease after Allogeneic Stem Cell Transplantation : A Single-Center Experience in Korea
- Hepatosplenic Tuberculosis Mimicking Disseminated Candidiasis in Patients With Acute Leukemia
- Necrotizing Enterocolitis : Experience of 27 Cases From a Single Korean Institution
- Comparison of 2 Preparative Regimens for Stem Cell Transplantation from HLA-Matched Sibling Donors in Patients with Advanced Myelodysplastic Syndrome
- Favorable outcomes of intravenous busulfan, fludarabine, and 400 cGy total body irradiation-based reduced-intensity conditioning allogeneic stem cell transplantation for acute myelogenous leukemia with old age and/or co-morbidities
- Investigation of Ru/TiN Bottom Electrodes Prepared by Chemical Vapor Deposition
- Spontaneous Pneumothorax Developed in Patients with Bronchiolitis Obliterans after Unrelated Hematopoietic Stem Cell Transplantation : Case Report and Review of the Literature
- Laser-induced Epitaxial Growth (LEG) Technology for High Density 3-D Stacked Memory with High Productivity
- Laser-induced Epitaxial Growth (LEG) Technology for High Density 3-D Stacked Memory with High Productivity
- Device Performance Improvement Based on Transient Enhanced Diffusion Suppression in the Deep Sub-Quarter Micron Scale
- Device Performances Improvement Based on TED Suppression in Deep Sub-Quarter Micron Regime
- Ni Germano-Salicide Technology for High Performance MOSFETs
- Ni Germano-Salicide Technology for High Performance MOSFETs
- Elimination of Al Line and Via Resistance Degradation under HTS Test in Application of F-Doped Oxide as Intermetal Dielectric
- The Origin of Micro-Loading Effect of TEOS-O3 Oxide II
- Fas, Fas-Associated Death Domain-Like Interleukin 1β-Converting Enzyme-Like Inhibitory Protein, and Apoptotic Features of Elderly Acute Myeloid Leukemia Based on Response to Induction Chemotherapy
- Performance of DRAM Cell Transistor with Thermal Desorption Silicon Etching (TDSE) and Selective Si Channel Epi Techniques
- Investigation of Ru/TiN Bottom Electrodes Prepared by Chemical Vapor Deposition