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NTT Microsystem Integration Laboratories | 論文
- Microfabricated On-Line Sensor for Continuous Monitoring of L-Glutamate
- DIRECT OBSERVATIONS OF SYNAPTIC GLUTAMATE RELEASE MODULATED BY GABA AND NEUROTROPHINS IN CULTURED RAT CORTICAL NEURONS
- マイクロディスクアレイ電極によるフェムトモルオ-ダ-のアセチルコリンの検出
- 分子テンプレ-トで修飾した電極によるカテコ-ル,カテコ-ルアミン類の選択的検出
- Measurements of Impurity Diffusion Coefficients in Ionic Melts with High Accuracy under Microgravity (特集 MSL-1(3))
- Mutation of the p53 Tumor Suppressor Gene in Oral Squamous Cell Carcinoma
- Anaplastic Large Cell Lymphoma (ALCL) in the Oral Mucosa with Repeating Recurrence and Spontaneous Regression of Ulceration : Report of a case
- An Adaptive Fingerprint-Sensing Scheme for a User Authentication System with a Fingerprint Sensor LSI(Integrated Electronics)
- Thick On-Chip Interconnections by Cu-Damascene Processes Using a Photosensitive Polymer
- Low-Cost Millimeter-Wave Photonic Techniques for Gigabit/s Wireless Link(Photonic Links for Wireless Communications)(Special Issue on Recent Progress in Microwave and Millimeter-wave Photonics Technologies)
- Application of Organic Silicon Clusters to Pattern Transfer Process for Deep UV Lithography
- Gain Improvement of a 2.4-GHz/5-GHz CMOS Low Noise Amplifier by Using High-Resistivity Silicon-on-Insulator Wafers
- Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
- Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
- Effect of Strain in Epitaxially Grown SrRuO_3 Thin Films on Crystal Structure and Electric Properties
- Thick Au High-Q Inductor and Its Chip-on-Chip Bonding on an RF IC for Various Frequencies
- RF-MEMS Switch Structure for Low-Voltage Actuation and High-Density Integration
- Novel Structure and Fabrication Process for Integrated RF Microelectromechanical-System Technology
- Electrodeposition of Organic Dielectric Film and Its Application to Vibrational Microelectromechanical System Devices
- Integrated RF-MEMS Technology with Wafer-Level Encapsulation