スポンサーリンク
Department of Materials Science and Engineering, Ibaraki University | 論文
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
- A Linear Muffin-Tin Orbital Calculation of Local Electronic and Magnetic Properties of YFe_Mo_2 and YFe_10Mo_2N
- Monte Carlo Simulation of Growth Process of Two-Dimensional Quasicrystal
- Computer Simulation of Growth Process of Binary Quasi Crystal
- Computer Simulation of Film Growth Process on the Two-Dimensional Penrose Pattern
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects
- Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating
- Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
- Microwave Plasma Nitriding of Hollow Tube Inner Wall
- Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film
- Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film
- The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film
- Interface Reaction between Solder and Plated Nickel Film
- 栃木県川治ダム予定地のワイラカイト相変質
- RpoS-Dependent Expression of the Second Lysine Decarboxylase Gene in Escherichia coli