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Department of Materials Science and Engineering, Ibaraki University | 論文
- 多結晶銅薄膜の粒成長に及ぼす不純物の影響
- Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires
- Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
- Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
- Further Assessment of the Kissinger Formula in Simulation of Thermal Desorption Spectrum of Hydrogen
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
- Numerical Simulation of Copper Precipitation during Aging in Deformed Fe-Cu Alloys
- ナノスケールダマシン銅配線のアニーリングによる構造変化
- EBSDによる超微細Cu配線深さ方向の微細構造解析
- Further Assessment of the Kissinger Formula in Simulation of Thermal Desorption Spectrum of Hydrogen