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Department of Electrical Engineering, Toyo University | 論文
- Study on the Mechanisms of Chemical Mechanical Polishing on Copper and Aluminum Surfaces Employing In Situ Infrared Spectroscopy
- Molecular Detection in a Microfluidic Device by Streaming Current Measurements
- Translocation of a Long DNA Chain Passing Through a Nanofabricated Pore
- A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy
- Cleaning of Silicon Surfaces by NF_3-Added Hydrogen and Water-Vapor Plasma Downstream Treatment
- Heliconwave Plasma Which Contains Negative Ion
- Biochip Which Examines Hepatic Function by Employing Colorimetric Method
- Protein Carbonylation Detected with Light and Heavy Isotope-Labeled 2,4-Dinitrophenylhydrazine by Matrix-Assisted Laser Desorption/Ionization Time-of-Flight Mass Spectrometry
- Transport of Human Immunoglobulin G and Fc-Fusion Proteins to Chicken Egg Yolk(BIOCHEMICAL ENGINEERING)
- Production of Anti-CD2 Chimeric Antibody by Recombinant Animal Cells(CELL AND TISSUE ENGINEERING)
- Production of Anti-Prion scFv-Fc Fusion Proteins by Recombinant Animal Cells
- Etching Reactivity of Negative Ions Generated in Cl_2 Downstream Plasma
- Electron Energy Control in Inductively Coupled Plasma Employing Multimode Antenna
- Thin Film Detection Employing Frequency Shift in Sheath Current Oscillation
- Excitation of Sheath Oscillating Current by Superimposing Pulse Voltage
- Atomic Layer Controlled Digital Etching of Silicon : Etching and Deposition Technology
- Atomic Layer Controlled Digital Etching of Silicon
- Fabrication of Quartz Microcapillary Electrophoresis Chips Using Plasma Etching
- Gap-Filling of Cu Employing Self-Sustained Sputtering with ICP Ionization
- In-Situ Observation of Oxygen Exposed Hydrogen Terminated Silicon Surfaces