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Department Of Materials Science And Engineering Kyoto University | 論文
- Thermally Stable Photoalignment Layer of a Novel Photo-Crosslinkable Polymethacrylate for Liquid Crystal Display : Structure and Mechanical and Thermal Properties of Condensed Matter
- Functionalized Mesogenic Composite for Photorefractive Applications
- Optical Anisotropy of Photo - Crosslinkable Polymer Film and Photoalignment Control of Nematic Liquid Crystals Using Nonpolarized Ultraviolet Irradiation
- Accumulation and Subcellular Localization of Cesium in Mycelia of Streptomyces lividans and a Cs Tolerant Strain, Streptomyces sp. TOHO-2
- Muon Spin Relaxation Study of Magnetism of a Triangular Lattice BaVs_3
- Resistivity Reduction and Adhesion Increase Induced by Surface and Interface Segregation of Ti Atoms in Cu(Ti) Alloy Films on Glass Substrates
- Effects of Dielectric-Layer Composition on Growth of Self-Formed Ti-Rich Barrier Layers in Cu(1at% Ti)/Low-k Samples
- 極薄バリア層自己形成技術--冶金学的なアプローチ (特集 これだけは知っておきたい最新の配線・実装材料技術)
- Self-formation of Ti-rich interfacial layers in Cu(Ti) alloy films (Special issue: Solid state devices and materials)
- Cu(Ti)合金微細配線における極薄バリア層の自己組織形成
- Self-Formation of Ti-rich Interfacial Layers in Cu(Ti) Alloy Films
- ULSI Si半導体デバイス用のCu配線材のナノ化の課題
- Grain Growth Mechanism of Cu Thin Films
- The Effect of Target Purities on Grain Growth in Sputtered Copper Thin Films
- p型SiC半導体/TiAl系オーミック・コンタクト材の界面構造
- Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films
- The Effect of Strain Distribution on Abnormal Grain Growth in Cu Thin Films
- Effect of Annealing Atmosphere on Void Formation in Copper Interconnects
- Hastelloy C-276 基板の降伏挙動制御による RE-123 coated conductor のひずみ特性向上
- 23pWZ-5 AuCdの熱弾性マルテンサイト変態に伴う欠陥構造の変化(23pWZ 格子欠陥・ナノ構造(金属,点欠陥,シュミレーション),領域10(誘電体格子欠陥,X線・粒子線フォノン))