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Department Of Materials Science And Engineering Ibaraki University | 論文
- Reliability Enhancement of Thick Al-Cu Wire Bonds in IGBT Modules Using Al_2Cu Precipitates
- Modeling Pearlite Transformation in Super-high Strength Wire Rods : II. Simulation in Fe-C Base Multi-component Alloys
- Modeling Pearlite Transformation in Super-high Strength Wire Rods : I. Modeling and Simulation in Fe-C-X Ternary Alloys
- Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches
- Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects
- Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure
- Further Assessment of the Kissinger Formula in Simulation of Thermal Desorption Spectrum of Hydrogen
- Influence of Carbon Segregation to Dislocations on Thermal Desorption Spectrum of Hydrogen in Medium Carbon Martensitic Steels
- Coating Adhesion Evaluation by Nanoscratching Simulation Using the Molecular Dynamics Method
- Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects
- Numerical Simulation of Copper Precipitation during Aging in Deformed Fe-Cu Alloys
- Influence of Minimum Barrier Metal Thickness at Trenches on Void Formation in 50-nm-wide Cu Wiring
- Molecular Dynamics Study of the Structural Changes of Ultra-fine Particles
- Further Assessment of the Kissinger Formula in Simulation of Thermal Desorption Spectrum of Hydrogen
- Influence of Carbon Segregation to Dislocations on Thermal Desorption Spectrum of Hydrogen in Medium Carbon Martensitic Steels