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Department Of Electrical And Electronic Engineering Faculty Of Engineering Yamaguchi University | 論文
- Threshold Current Density in ZnS/MgBeZnS Quantum Well Ultraviolet Lasers
- Development of White Light Emitting Diodes by Multi-layered Red, Green, and Bule Phosphors Excited by Near-ultraviolet Light Emitting Diodes
- Near-ultraviolet LED of the External Quantum Efficiency Over 45% and its Application to High-color Rendering Phosphor Conversion White LEDs
- Principles of Time Domain Calculus of Microwave Resonator Parameters(Recent Technologies for Microwave and Millimeter-wave Passive Devices)
- Control of Superconducting Properties of LnBa_2Cu_3O_y (Ln=Y, Eu) Thin Film Microbridges by Visible Light Irradiation
- Fabrication of Realistic and Dynamic Human Head Phantoms
- Gefitinib as a First Line of Therapy in Non-Small Cell Lung Cancer with Brain Metastases
- Direct Evidence that Dislocations are Non-Radiative Recombination Centers in GaN
- Surface Pretreatment of Bulk GaN for Homoepitaxial Growth by Metalorganic Chemical Vapor Deposition
- Bismuth-Glass Composites with a Metal-Insulator-Transition-Like Resistivity Change at High Temperatures
- Dependence of Light Extraction From Near-Ultraviolet Light-Emitting Diodes on Refraction Index, Transmittance and Shape
- A Practical Design Consideration for Coupled-Resonator Laminated Band Elimination Filter Fabricated with LTCC of High Dielectric Constant (特集:論文誌C発刊30周年記念)
- Artificial Dielectric Resonator Made of Spherical Metal Particles
- Angiogenesis and Metastasis Marker of Human Tumors
- Absorption Factor and Influence of LPA Factor on Stress and Diffraction Line Width in X-Ray Stress Measurement with and without Restriction of X-Ray Diffraction Area
- Biexciton Luminescence from GaN Epitaxial Layers
- Excitonic Emission in GaN Films on AlN Substrates Using Microwave-Excited N Plasma Method
- Study on the Luminous and Thermal Characteristics of High-Power Near-Ultraviolet LED Packages with Various Chip Arrangements
- Development of Light Sources by Large-Scale Integrated Light-Emitting Diodes
- Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages