Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages

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概要

• 論文の詳細を見る

• We have recently fabricated high-power near-ultraviolet (n-UV) light-emitting diodes (LED) on ceramic packages without sub-mount by direct flip-chip bonding (DFCB) technique. In ceramic packages, for example, pad electrodes of near-ultraviolet (n-UV: λ_<peak>〜405nm) LED chips the size of a 0.35mm square were bonded on the metallized packages using metal stud bumps. The cross-sectional microstructures of the chip/bump/ceramic of non-degraded and degraded DFCB packages have been investigated by electron microscopic observation with an Energy Dispersive X-ray fluorescence (EDX) spectrometer, an X-ray CT, and Ultrasonic Scanning Inspection. For the first time, we have confirmed the firm flip-chip interfaces of DFCB packages while the crack between the GaN layer and the 1st metal for p-type electrode reflector which caused failure has been observed in the degraded chip. Ultrasonic testing is quite effective to detect small defects in the package and can be expected to support process optimization.

• 社団法人照明学会の論文

著者

• FUKUI Takeshi

  Graduate School of Science and Engineering, Yamaguchi University

• MIYACHI Tsutomu

  Graduate School of Science and Engineering, Yamaguchi University

• NAKAMURA Nobutaka

  Choshu Industry CO., LTD

• KURAI Satoshi

  Graduate School of Science and Engineering, Yamaguchi University

• TAGUCHI Tsunemasa

  Graduate School of Science and Engineering, Yamaguchi University

• Fukui Takeshi

  Graduate School Of Science And Engineering Yamaguchi University

• Miyachi Tsutomu

  Graduate School Of Science And Engineering Yamaguchi University

• TAGUCHI Takao

  SORTEC Corporation

• Uchida Yuji

  Faculty Of Engineering Yamaguchi University

• Kurai Satoshi

  Science And Engineering Yamaguchi University

• Sakuta Hiroaki

  Graduate School Of Science And Engineering Yamaguchi University

• Taguchi T

  Department Of Materials Science And Engineering Yamaguchi University

• Kurai Satoshi

  Department Of Electrical And Electronic Engineering Faculty Of Engineering Yamaguchi University

• Kurai Satoshi

  Department Of Electrical And Electronic Engineering Tokushima University

• FUJII Satoshi

  Science and Engineering, Yamaguchi University

• MIYACHI Tsutomu

  Science and Engineering, Yamaguchi University

• FUKUI Tsuyoshi

  Science and Engineering, Yamaguchi University

• SAKUTA Hiroaki

  Science and Engineering, Yamaguchi University

• NAKAMURA Noritaka

  Science and Engineering, Yamaguchi University

• UCHIDA Yuji

  Science and Engineering, Yamaguchi University

• TAGUCHI Tsunemasa

  Science and Engineering, Yamaguchi University

• Taguchi Tsunemasa

  Graduate School Of Science And Engineering Yamaguchi University

• Taguchi Tsunemasa

  Faculty Of Engineering Yamaguchi University

• Nakamura Nobutaka

  Choshu Industry Co. Ltd

• Taguchi T

  Department Of Electrical And Electronic Engineering Yamaguchi University

• Taguchi Tsunemasa

  Department Of Materials Science And Engineering Yamaguchi University

• Taguchi Tsunemasa

  Science And Engineering Yamaguchi University

• Fujii Satoshi

  Science And Engineering Yamaguchi University

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