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Center For Microelectronic Systems Kyushu Institute Of Technology | 論文
- Electroluminescence of Nanocrystal Si Embedded in Single-Crystal CaF_2/Si(111)
- Influence on Electrical Characteristic of Direct Au-Bumping on MOSFET
- Wafer-level Fabrication of Compliant Bump
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Area-Time Complexities of Multi-Valued Decision Diagrams(Discrete Mathematics and Its Applications)
- Measurement of Dynamic Strain during Ultrasonic Au-Bumping on Si Chip
- Application of Microwave Plasma Gate Oxidation to Strained-Si on SiGe and SGOI
- SOI-MOS/Diode Composite Photodetector Device
- New SOI-CBiCMOS with Merged Device Structure
- Reduction of the Floating-Body Effect in SOI MOSFETs by Using Schottky Source/Drain Contacts
- Fault Diagnosis for RAMs Using Walsh Spectrum(Memory Testing)(Test and Verification of VLSI)
- Characteristics of Thin-Film Transistors Fabricated on Nucleation-Controlled Poly-Si Films by Surface Steps
- Microstrip Gas Chamber for X-Rays and Neutrons
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- An Electrically Adjustable 3-Terminal Regulator for Post-Fabrication Level-Trimming with a Reliable 1-Wire Serial I/O
- Properties of Ink-Droplet Formation in Double-Gate Electrospray
- Electrostatic Inkjet Patterning Using Si Needle Prepared by Anodization
- Electrostatic Droplet Ejection Using Planar Needle Inkjet Head
- Field Electron Emission from Inkjet-Printed Carbon Black
- Improved Near-Infrared Sensitivity with a Side-Illuminated Photosensor