Initial Cu Growth in Cu-Seeded and Ru-Lined Narrow Trenches for Supercritical Fluid Cu Chemical Deposition

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概要

• 論文の詳細を見る

• The morphological stability of Cu films in narrow trenches during the initial growth of Cu was studied at temperatures of 140–280 °C for the chemical deposition of Cu in supercritical CO2. Cu seed layers agglomerated and the deposited Cu and the seed layer coalesced at elevated temperatures. This mechanism resulted in bottom-up like growth at lower temperatures of 160–180 °C. The seed agglomeration was suppressed by starting deposition before reaching the temperature at which agglomeration started of about 150 °C. When Ru-lined trenches were used instead of Cu-seeded trenches, no clear agglomeration or grain coarsening was observed and Cu grew with a conformal topography.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2010-05-25

著者

• Yukihiro Shimogaki

  Department of Materials Engineering, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo, Tokyo 113-8656, Japan

• Kondoh Eiichi

  Graduate School of Medicine and Engineering, University of Yamanashi, Kofu 400-8511, Japan

• Kakeru Tamai

  Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu 400-8511, Japan

• Matsubara Masahiro

  Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu 400-8511, Japan

• Tamai Kakeru

  Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu 400-8511, Japan

関連論文

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• Metalorganic Chemical Vapor Deposition of Al2O3 Thin Films from Dimethylaluminumhydride and O2
• In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation
• Fast Imaging Ellipsometer Using a LiNbO
• Step Coverage Quality of Cu Films by Supercritical Fluid Deposition Compared with Chemical Vapor Deposition
• Initial Cu Growth in Cu-Seeded and Ru-Lined Narrow Trenches for Supercritical Fluid Cu Chemical Deposition

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