Dominant Device Instability Mechanism in Scaled Metal–Oxide–Semiconductor Field-Effect Transistors with Hafnium Oxide Dielectric
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概要
- 論文の詳細を見る
The negative-bias temperature instability (NBTI) and positive-bias temperature instability (PBTI) of metal–oxide–semiconductor field-effect transistors (MOSFETs) with high dielectric constant ($k$) gate dielectrics have been studied by varying the physical thickness of high-$k$ dielectric. Both PBTI and NBTI were reduced with decrease in the high-$k$ dielectric thickness, but NBTI reduction saturated in the thin high-$k$ region. Since residual NBTI is sufficiently large to cause device instability, NBTI is still a dominant reliability concern in scaled MOSFETs.
- 2009-09-25
著者
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Kim Tea
Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Korea
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Choi Rino
Inha University, 253 Yonghyun-dong, Nam-gu, Incheon 402-751, Korea
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Lee Byoung
Gwangju Institute of Science and Technology, 1 Oryong-dong, Buk-gu, Gwangju 500-712, Korea
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Park Hokyung
SEMATECH, 2706 Montopolis Drive, Austin, TX 78741, U.S.A.
関連論文
- Effect of Trap Profile on Device Characteristics of Metal–Oxide–Semiconductor Field Effect Transistors with Hafnium-Based Dielectrics
- Dominant Device Instability Mechanism in Scaled Metal–Oxide–Semiconductor Field-Effect Transistors with Hafnium Oxide Dielectric
- Stress-Polarity-Independent Negative Threshold Voltage Shift in HfO2/TiN P-Channel Metal Oxide Semiconductor Field-Effect Transistor