Fully Analytical Modeling of Cu Interconnects up to 110 GHz
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概要
- 論文の詳細を見る
Copper interconnects with and without the grounded shielding on the silicon substrate are modeled from 1 to 110 GHz. The fully-analytical model is composed of the cascaded lumped resistor–inductor–conductor–capacitor (RLGC) circuit elements with 20 sections, and featured physical-based, scalable, and frequency-dependent characteristics. An excellent agreement is obtained between the measured, simulated, and modeled $S$-parameters without any optimization procedure. The proposed approach can be applied for interconnect modeling for integrated-circuits over a wide frequency range.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-04-25
著者
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LIU Sally
Taiwan Semiconductor Manufacturing Company
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Hsu Shawn
Department Of Electrical Engineering And Computer Science The University Of Michigan
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Yeh Tzu-jin
Taiwan Semiconductor Manufacturing Company
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YANG Ming-Ta
Taiwan Semiconductor Manufacturing Company
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Hsu Shawn
Department of Electrical Engineering and Institute of Electronics Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., Hsinchu, Taiwan 300, R.O.C.
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Jin Jun-De
Department of Electrical Engineering and Institute of Electronics Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., Hsinchu, Taiwan 300, R.O.C.
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Yang Ming-Ta
Taiwan Semiconductor Manufacturing Company, 9, Creation Rd. 1, Hsinchu Science Park, Hsinchu, Taiwan 300-77, R.O.C.
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