Effects of Post-Annealing on the Conduction Properties of Pt/(Ba, Sr)TiO3/Pt Capacitors for Dynamic Random Access Memory Applications
スポンサーリンク
概要
- 論文の詳細を見る
Pt/(Ba, Sr)TiO3/Pt capacitors were fabricated on TiN/Ti/ Poly–Si/SiO2/Si substrate by sputtering technique and effects of post-annealing conditions on the current vs. voltage ( I–V ) characteristics of the capacitors were investigated. It was found that leakage currents of Pt/BST/Pt capacitors were greatly depended on the annealing sequence as well as annealing atmosphere. BST films annealed under Ar/H2 or N2 showed much higher leakage current than as-deposited films regardless of the fabrication of top electrode. On the contrary, annealing under O2 atmosphere was effective to reduce leakage currents of the BST films if annealing process was carried out after fabrication of top electrode. Leakage current of Pt/BST(50 nm)/Pt capacitors annealed under O2 atmosphere at 500° C for 1 h after fabrication of Pt top electrode was 5×10-7 A/cm2 even at 7 V. In this work, effects of annealing conditions on the I–V properties of Pt/BST/Pt capacitors were explained with energy band diagram in which oxygen vacancies play a key role.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1997-07-15
著者
-
Oh Ki-young
Process Group Advanced Technology Laboratory Lg Semicon
-
ROH Jae-Sung
Process Group, Advanced Technology Laboratory, LG Semicon
-
KIM Jae-Jeong
Process Group, Advanced Technology Laboratory, LG Semicon
-
Seon Jeong-min
Process Group Advanced Technology Laboratory Lg Semicon
-
Joo Jae-hyun
Process Development Team Semiconductor R&d Division Samsung Electronics Co. Ltd.
-
Jeon Yoo-chan
Process Group Advanced Technology Laboratory Lg Semicon
-
Roh Jae-Sung
Process Group, Advanced Technology Laboratory, LG Semicon, Cheongju, Korea
-
Jeon Yoo-Chan
Process Group, Advanced Technology Laboratory, LG Semicon, Cheongju, Korea
-
Oh Ki-Young
Process Group, Advanced Technology Laboratory, LG Semicon, Cheongju, Korea
-
Joo Jae-Hyun
Process Group, Advanced Technology Laboratory, LG Semicon, Cheongju, Korea
関連論文
- Integration of Split Word Line Ferroelectric Memories Using Etch Stopping Layers and Multi-Layer Etching Technology
- Integration of Split Word Line Ferroelectric Memories Using Etch Stopping Layers and Multi-Layer Etching Technology
- Integration of Split Word Line Ferroelectric Memories Using Etch Stopping Layers and Multi-Layer Etching Technology
- Investigation of Ruthenium Electrodes for (Ba, Sr)TiO_3 Thin Films
- Effects of Post-Annealing on the Conduction Properties of Pt/(Ba, Sr)TiO_3/Pt Capacitors for Dynamic Random Access Memory Applications
- Low Temperature Chemical Vapor Deposition of (Ba, Sr)TiO_3 Thin Films for High Density Dynamic Random Access Memory Capacitors
- Rugged Metal Electrode (RME) for High Density Memory Devices : Surfaces, Interfaces, and Films
- Investigation of Ruthenium Electrodes for (Ba,Sr)TiO3 Thin Films
- Electrical Stress Effect on Poly-Si Thin Film Transistors Fabricated by Metal Induced Lateral Crystallization
- Effects of Post-Annealing on the Conduction Properties of Pt/(Ba, Sr)TiO3/Pt Capacitors for Dynamic Random Access Memory Applications