J031044 熱疲労によるセラミックス基板の強度低下に関する研究([J03104]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

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In order to establish evaluation method of thermal fatigue property on ceramic substrate, thermal cycle fatigue test and 4 point bending test were carried out using specimens of Cu/Al203. As the results, the ratio of residual strength P/Po has decreased with increasing thermal cycles. The cracks were generated on the ceramic at about corner of metal plate. Next, in order to investigate the residual stress distribution of ceramics caused by junction between ceramics and metal plate and the stress distribution of ceramics caused by thermal fatigue, FEM was carried out. As the results, it has been understood that the tensile residual stress on ceramics at about corner of metal plate is generated by the junction process and that the repetition of the tensile stress and compressive stress on ceramics at about corner of metal plate are occurred by the thermal cycles.
一般社団法人日本機械学会の論文
2011-09-11