J0601-5-3 セラミックス基板の熱サイクル疲労による損傷評価([J0601-5]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(5))

概要

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In order to establish evaluation method of thermal fatigue property on ceramic substrate, thermal cycle fatigue test and 4 point bending test were carried out using specimens of Cu/Al_2O_3(B Corp.), Al/AlN(B Corp.), Cu/AlN(D Corp.) and Cu/Si_3N_4(E Corp.). As the results, the ratio of residual strength P/P_0 for Cu/Al_2O_3(B Corp.) and Cu/AlN(D Corp.) has decreased with increasing thermal cycles. The crack of these specimens was generated on the ceramic at corner of metal plate. Stress intensity factor K_I of Cu/Al_2O_3(B Corp.), which calculated from the crack size is slightly smaller than fracture toughness K_<IC> of Al_2O_3, and K, of Cu/AlN(D Corp.) was almost equal to K_<IC> of A1N.
一般社団法人日本機械学会の論文
2010-09-04