1926 極細線材の機械的特性に及ぼすひずみ速度の影響(J16-4 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(4),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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Recently, because the micro-machine is noticed and electronic equipments are made much lighter and smaller, the demand for micro materials is increasing. However the mechanical properties data of the micro materials obviously run short and the evaluation method of micro materials is different according to the researcher. Therefore, the establishment of the test method for the micro materials is very necessary. In this study, the tensile strength tests were carried out using the bonding wires of Cu, Au and Al/Si1% as the material. Its diameters were 20μm. The strain rate of the tensile strength tests were three kinds of 2.5×10^<-3>s^<-1>, 2.5×10^<-4>s^<-1> and 2.5×10^<-5>s^<-1>. As the results, the tensile strength with strain rate of 2.5×10^<-3>s^<-1> were the largest regardless of the materials. The elongation with strain rate of 2.5×10^<-3>s^<-1> were the largest in case of Cu and Au wires. Therefore, it was found that tensile strength for bonding wires increased in proportion to strain rate and that elongation for bonding wires of Cu and Au increased in proportion to strain rate.
社団法人日本機械学会の論文
2007-09-07