OS0516 電着法で創製した銅薄膜の疲労特性に関する研究(OS5-4 薄膜・表面改質,OS-5 材料の疲労挙動と損傷評価2)

概要

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Copper thin films have been widely used for wiring of electric equipment because of high thermal and electrical conductivity, and low cost. In this paper, two kinds of copper thin films were produced by electrodeposition using copper sulfate bath with and without brightener. Rolled films were prepared for comparison. The fatigue test and the fatigue crack propagation test were done in these three kinds of thin films. The fatigue limit of the electrodeposited films was lower than that of rolled films. The ratio of the fatigue limit to the tensile strength is about 0.5 for electrodeposited films with brightener and rolled films. The fatigue limit of electrodeposited films without brightener was about one-fifth of the tensile strength. The crack propagation rate near the threshold is higher in electrodeposited films than in rolled films, while in the intermediate-rate region there is no difference between films.
一般社団法人日本機械学会の論文
2011-07-16