607 新規開発高機能銀の特性と組織の関係(OS4-(2)オーガナイズドセッション《材料と組織》)

概要

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Recently, demands for reliability to connection of embedded semiconductor devices are increasing as electronic devices become high-performance and compact. The wire bonding is frequently used as a method of connecting lead wires with an aluminum electrode. Although gold has mainly been used as the wire materials because it has high electrical conductivity, deformability and can be formed into an extra-thin wire, it raises the cost and also the resources are limited. Therefore the high-function silver which has higher electric conductivity and better mechanical strength has been developed by Three-O Ltd. as an alternative material for gold. In this study, annealing characteristics of cold-rolled sheets of two types of high-function silver have been investigated by means of Vickers hardness test. It was found that abrupt softening occurs at a temperature range from 100 to 150℃ for the pure-silver-type material. Also, the hardness of annealed material of this type was confirmed to be about twice as hard as normal annealed pure silver.
一般社団法人日本機械学会の論文
2011-08-26