J0601-4-3 温度・ひずみ速度依存性を考慮した基板配線銅薄膜の非弾性材料モデリング([J0601-4]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

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The mechanical properties of electroplated Cu thin films are quite different from those of bulk Cu. Under the range of temperature that electronic devices are used or fabricated, creep property of Cu thin films changes drastically. In order to model the mechanical properties of Cu thin films precisely, we should take into account this change of strain-rate dependence with temperature. In this study, we proposed the inelastic constitutive model combining the rate-independent model and rate-dependent non-unified model. And thermo-mechanical analysis of Cu through hole was carried out to evaluate the influence of Cu creep deformation.
一般社団法人日本機械学会の論文
2010-09-04