2432 エポキシ樹脂と鋼材からなる粘弾性積層はりの硬化過程における反り変形挙動(G03-8 変形・弾塑性挙動(1),G03 材料力学)

概要

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Epoxy resin is usually used as a encapsulation of IC chips for electronic parts. Epoxy resin is transformed from liquid to solid by the chemical curing reaction, and then residual stresses and warp deformation are generated in the electronic parts. In this report, the warp deformation behavior for laminated beam caused by the chemical curing process of epoxy resin was examined from both sides of the experiment and theory, which are the thermo-viscoelastic numerical analysis based on the linear viscoelasticity theory and the Finite Element Analysis about the laminated beam consisted of epoxy resin and steel. As a result, it was clarified that the result of thermo-viscoelastic numerical analysis about warp deformation accorded with experimental values almost well, and the warp deformation behavior could be predicted by the thermo-viscoelastic numerical analysis with the precision that there was no problem in practical use.
社団法人日本機械学会の論文
2007-09-07