レーザリフトオフによる金属薄膜のパターニングとシミュレーション
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概要
- 論文の詳細を見る
For submicron size device application, the selective laser lift-off using the heat insulation of hydrocarbon film was applied to the patterning of metal thin film. Experimentally, Ni and Cu films were patterned on Si substrates and Pt films were patterned on fused quartz substrates, successfully. For clarifying the mechanism, temperature simulations were carried with for the present laser lift-off technique. As a result, in the laser lift-off process, the temperature of the metal layer did not reach the melting or vaporization point while the temperature of the hydrocarbon layer was found to be elevated above 250℃. These findings require a new mechanism including the vaporization or explosive phenomenon of hydrocarbon layer other than the simple metal evaporation model. In addition, it was found that a temperature characteristic was more suitable for a Si substrate than a fused quartz substrate by a simulation that considered reflectance.
- 石川工業高等専門学校の論文
- 2007-03-30
著者
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Otsubo Shigeru
Department Of Electrical Engineering Ishikawa National College Of Tecchnology Tsubata
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瀬戸 孝宏
石川高専門専攻科電子機械工学専攻
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