916 Evaluation of Interface Strength at Free Edge between Thin Films
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概要
- 論文の詳細を見る
In this study, delamination tests using a sandwich type specimen are conducted for eight combinations of materials, thin films on silicon substrate, in order to develop a method for quantitative evaluation and comparison of crack initiation strength from the free edge. Stress distribution along interface at the crack initiation is analyzed by boundary element method. Since the order of stress singularities, λ, in the materials are less than 0.07, the stress field near the interface edge is almost constant in atomic level. Then, the critical strength for the interface cracking is quantitatively represented by the concentrated stress near the edge, σ_<ya>・Based on this critical stress, the effects of the several factors such as existence of oxidized interlayer, species of thin film materials and deposition process of thin film on the interface strength are examined as well.
- 一般社団法人日本機械学会の論文
- 2005-03-18
著者
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Truong Do
Graduate School Of Engineering Physics And Mechanics Kyoto University
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HIRAKATA Hiroyuki
Department of Mechanical Engineering and Science, Kyoto University
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KITAMURA Takayuki
Department of Mechanical Engineering and Science, Kyoto University
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Kitamura Takayuki
Department Of Mechanical Engineering And Science Kyoto University
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Kitamura Takayuki
Department Of Engineering Physics And Mechanics Kyoto University
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Hirakata Hiroyuki
Department Of Mechanical Engineering And Science Kyoto University
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Hirakata Hiroyuki
Department Of Engineering Physics And Mechanics Kyoto University
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Hirakata Hiroyuki
Dept.of Mechanical Engineering And Science Kyoto University
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Kitamura Takayuki
Department Of Economics Kanagawa University
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Kitamura Takayuki
Department Of Anesthesia And Pain Relief Center The University Of Tokyo Hospital
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