OS5(3)-11(OS05W0236) Evaluation of Interface Strength of Micro-Components by AFM
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概要
- 論文の詳細を見る
- 一般社団法人日本機械学会の論文
- 2003-09-09
著者
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Kitamura Takayuki
Dept. Of Engineering Physics And Mechanics Kyoto Univ.
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Hirakata Hiroyuki
Department Of Engineering Physics And Mechanics Kyoto University
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Hirakata Hiroyuki
Graduate School Of Engineering Physics And Mechanics Kyoto Univ.
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YAMAMOTO Yoshitake
Graduate School of Engineering Physics and Mechanics, Kyoto University
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Yamamoto Yoshitake
Graduate School Of Engineering Physics And Mechanics Kyoto University
関連論文
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- E-19 EFFECT OF MATERIAL THICKNESS ON THE SINGULAR STRESS FIELD IN ELASTIC-CREEP BI-MATERIAL INTERFACE(Session: Contact strength/Mechanical)
- Applicability of Fracture Mechanics on Brittle Delamination of Nanoscale Film Edge
- OS5(3)-12(OS05W0166) Introduction Method of Sharp Pre-Crack Along Interface Between Thin Film and Substrate
- Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate(Advanced Technology of Experimental Mechanics)
- OS5(3)-11(OS05W0236) Evaluation of Interface Strength of Micro-Components by AFM