Accuracy estimation of shape measurement of thin-large panel with three-point-support inverting method(Nano/micro measurement and intelligent instrument)
スポンサーリンク
概要
- 論文の詳細を見る
In the semiconductor industry processing and measurement of silicon wafers in the nanometer order are required. Moreover, larger and thinner precise glass substrates are in demand for the purpose of enlargement and weight reducing of FPD. However, the accurate shape measurement of thin-large panels is difficult because of the vibration and deflection due to gravity and clamping forces. In this study, error factors and repeatability in the shape measurement of thin-large panels is investigated using the three-point-support inversion method.
- 一般社団法人日本機械学会の論文
- 2005-10-18
著者
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ITO Yukihiro
Department of Mechanical Systems Engineering, Tokyo University of Agriculture and Technology
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NATSU Wataru
Department of Mechanical Systems Engineering, Tokyo University of Agriculture and Technology
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KUNIEDA Masanori
Department of Mechanical Systems Engineering, Tokyo University of Agriculture and Technology
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Natsu Wataru
Department Of Mechanical Systems Engineering Tokyo University Of Agriculture And Technology
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Ito Yukihiro
Department Of Mechanical Systems Engineering Tokyo University Of Agriculture And Technology
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MARUYA Noriyuki
Metrology Systems Division, Kuroda Precision Industries Ltd.
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IGUCHI Nobuaki
Metrology Systems Division, Kuroda Precision Industries Ltd.
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Iguchi Nobuaki
Metrology Systems Division Kuroda Precision Industries Ltd.
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Maruya Noriyuki
Metrology Systems Division Kuroda Precision Industries Ltd.
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Kunieda Masanori
Univ. Tokyo Tokyo Jpn
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Kunieda Masanori
Department Of Mechanical System Engineering Tokyo University Of Agriculture And Technology
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Natsu Wataru
Department Of Mechanical Engineering Tokyo University Of Agriculture And Technology
関連論文
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- D32 Effect of Anisotropy on Shape Measurement Accuracy of Silicon Wafer Using Three-Point-Support Inverting Method(Nano/micro measurement and intelligent instruments)
- Accuracy Estimation of Shape Measurement of Thin-Large Panel with Three-Point-Support Inverting Method
- Accuracy estimation of shape measurement of thin-large panel with three-point-support inverting method(Nano/micro measurement and intelligent instrument)
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