異形シール溝加工におけるヘール加工技術の適用

概要

論文の詳細を見る
The rapid growth of the semiconductor processing industry is continuing along with the industrial growth of recent years. Attendant with this is the requirement for efforts to maintain a clean environment in the production of semiconductor devices. In vacuum devices, a seal groove becomes indispensable because seal effect of vacuum devices is dependent on its accuracy and finished roughness. Several kinds of groove which have inverse tapering cross sections are also required to improve seal effect. In case of machining these groove, traditional milling process and hand operational finish process are usually used which will be failure of scars and cutter marks in the bottom surface and the side of the groove and inefficient process. In this research, new automatic machining process by applying the non-rotational cutting method and CAM functions to generate NC code for 4 axes simultaneous controlled machining using commercially available CAM system has been developed. Machining examples demonstrate the possibility of obtaining an excellent machine finish in areas subject to suspicious seal groove processing.
社団法人精密工学会の論文
2006-06-05