Adhesion of Resist Micropatterns during Drying after Water Rinse
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概要
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The variation of residual strain in photoresist thin films can be detected by a strain gauge with high sensitivity. The adhesion of resist micropattern during drying after water rinse is studied in terms of the residual strain variation. The residual strain of a resist film varies markedly as water is evaporated from the resist surface. In order to improve the resist adhesion, it is important to decrease the residual strain during the drying process.
- 社団法人応用物理学会の論文
- 1995-08-15
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