Internal Stress in Evaporated Tellurium Films

概要

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The internal stress and electrical resistivity were measured during and after deposition for tellurium films evaporated on a glass substrate. Both tensile and compressive stresses were observed depending on the substrate temperature during deposition. For the films deposited at room temperature, a tensile stress was generated accompanied by a drastic decrease in the resistivity. In contrast, a compressive stress was initially developed in the films deposited at 100℃ and then the stress changed into the tensile one as the deposition progressed. The experimental results were interpreted in terms of the phase change mechanism and the lattice expansion and grain boundary annealing mechanisms, respectively.
社団法人応用物理学会の論文
1983-06-20