Study of CF_4, C_2F_6, SF_6 and NF_3 Decomposition Characteristics and Etching Performance in Plasma State
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概要
- 論文の詳細を見る
The decomposition characteristics and etching performances of CF_4, C_2F_6, SF_6 and NF_3 in their plasma state were studied for use as self-cleaning gases in plasma-enhanced chemical vapor deposition (PE-CVD) equipment. The study revealed several important characteristics of these gases. The plasma decomposition ratios are in the order of C_2F_6 > NF_3 ≫ SF_6 > CF_4. A large amount of CF_4 is formed as a result of the decomposition of C_2F_6. The decomposition ratio of these gases is strongly dependent on the plasma power density, but not appreciably on the temperature in the range of practical use. Moreover, the rate of F decrease of etchant through the plasma chamber appears to strongly correlate with the etch rate.
- 社団法人応用物理学会の論文
- 1997-09-15
著者
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Fukuda Tatsuo
Shiga Technology Center Iwatani International Corp.
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Koike Kunihiko
Shiga Technology Center Iwatani International Corp
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Koike Kunihiko
Shiga Technology Center Iwatani International Corp.
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FUJIKAWA Shizuichi
Iwatani Gas Research Laboratory Co., Ltd.
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SAEDA Manabu
Iwatani Gas Research Laboratory Co., Ltd.
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Saeda Manabu
Iwatani Gas Research Laboratory Co. Ltd.
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Fujikawa S
Mitsubishi Electric Corp. Hyogo Jpn
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