Analysis of Average Transport Critical Current Density of Oxide Superconductors Deposited on a Silver Base
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1996-01-15
著者
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YANG Tzong-Jer
Department of Electrophysics, National Chiao Tung University
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Chiou B‐s
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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Yang Tzong-jer
Department Of Electro-physics National Chiao-tung University
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LEE Win-Der
Institute of Electronics, National Chiao-Tung University
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CHIOU Bi-Shiou
Institute of Electronics, National Chiao-Tung University
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Lee Win-der
Institute Of Electronics National Chiao-tung University
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- Effect of Aluminum Seed Layer on the Crystallographic Texture and Electromigration Resistance of Physical Vapor Deposited Copper Interconnect
- Analysis of Average Transport Critical Current Density of Oxide Superconductors Deposited on a Silver Base
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