Wafer Treatment Using Electrolysis-Ionized Water

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概要

• 論文の詳細を見る

• Electrolysis-ionized water treatment is shown to be useful for removing polystyrene particles from contact holes, silicon surface cleaning and the removal of metal contamination such as copper. Electrolysis-ionized water has a controllable pH and a higher oxidation-reduction potential than chemicals. Moreover, this water does not contain acid or alkaline chemicals, and can easily be neutralized without adding chemicals. Electrolysis-ionized water treatment has great potential for ecologically safe and low cost semiconductor processing.

• 社団法人応用物理学会の論文
• 1994-10-15

著者

• Ikawa Eiji

  Ulsi Device Development Laboratories Nec Corporation

• Aoki Hidemitsu

  Ulsi Device Development Laboratories Nec Corporation

• AOTO Nahomi

  ULSI Device Development Laboratories, NEC Corporation

• Aoto N

  Nec Corp. Kanagawa Jpn

• Aoto Nahomi

  Ulsi Device Development Laboratories Nec Corporation

• Nakamori M

  Nec Corp. Kanagawa Jpn

• Nakamori Masaharu

  Ulsi Device Development Laboratories Nec Corporation

関連論文

• Effect of Metals (Fe,Cu) on 8-nm-Thick Gate Oxide Reliability
• 0.15μm CMOS Devices with Reduced Junction Capacitance
• Model for Al Etch-Rate Enhancement at Low Temperatures
• Oxide Etching Using Surface Wave Coupled Plasma
• Analysis of Fluorocarbon Film Deposited by Highly Selective Oxide Etching
• Wafer Treatment Using Electrolysis-Ionized Water
• Gate Electrode Etching Using a Transformer Coupled Plasma
• Reactions on Si(100) and Chemical Oxide Surfaces in Dissolved-Oxygen Controlled Deionized Water

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