Simultaneous Stress-Induced Al Extrusion and Void Formation Caused by High Temperature Annealing after Via-Hole Opening in Al Interconnects with Via-Holes
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1994-04-15
著者
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Shibata H
Toshiba Corp. Yokohama Jpn
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Shibata Hideki
Semiconductor Device Engineering Laboratory Toshiba Corporation
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HASHIMOTO Kazuhiko
Semiconductor Device Engineering Laboratory, Toshiba Corporation
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MATSUNO Tadashi
Semiconductor Device Engineering Laboratory, Toshiba Corporation
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Matsuno Tadashi
Semiconductor Device Engineering Laboratory Toshiba Corporation
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Hashimoto Kazuhiko
Semiconductor Device Engineering Laboratory Toshiba Corporation
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