Fine Particle Inspection Down to 38 nm on Bare Wafer with Micro Roughness by Side-Scattering Light Detection

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1993-01-30

著者

• Kembo Yukio

  Hitachi Kenki Fine Tech Co. Ltd.

• Kembo Yukio

  Production Engineering Research Laboratory Hitachi Ltd.

• Kembo Y

  Hitachi Kenki Fine Tech Co. Ltd.

• NOGUCHI Michitoshi

  Institute of Engineeering Mechanics and Systems, University of Tsukuba

• NOGUCHI Minori

  Production Engineering Research Laboratory, Hitachi, Ltd.,

• Noguchi M

  Institute Of Engineeering Mechanics And Systems University Of Tsukuba

関連論文

• Highly Precise Atomic Force Microscope Measurement of High-Aspect Nanostructure Free of Probe Bending Error
• Atomic Force Microscopy for High Aspect Ratio Structure Metrology
• Application of Time Slice to and Imaging System Using Acoustic Holography
• Fine Particle Inspection Down to 38 nm on Bare Wafer with Micro Roughness by Side-Scattering Light Detection
• Spatial Resolution Improvement for Ultrasonic Imaging of an Object Consisting of Multiple Planes with Level Differences Using Contour Extraction
• Detection and Imaging of Subsurface Microcracks in Silicon Wafers Using Photoacoustic Microscope : Photoacoustic Spectroscopy and Ultrasonic Imaging
• An Ultrasonic Imaging System Using a Matrix-Type Transducer Array
• Ultrasonic Imaging Reconstructed from the Inclination Angle of a Smooth Surface
• Highly Precise Atomic Force Microscope Measurement of High-Aspect Nanostructure Free of Probe Bending Error

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