4. 応用II:ダウンストリームアッシング,クリーニング(<小特集>表面波励起プラズマの生成とその応用)

概要

論文の詳細を見る
Downstream plasma ashing and cleaning which are applications of surface wave excited plasma for semiconductor device processing is introduced. Plasma downstream treatments aim at treating surfaces by electrically neutral reactive species generated in a plasma without influences of high energy particles such as electron, ion, and high frequency photons. Downstream processes are composed of generation of the reactive species in the plasma, transferring of the reactive species through the downstream, and reaction on the target surfaces. Through the ashing and cleaning process, it is shown that the downstream treatment performs high quality processing by control or alteration of the reaction in the plasma and the downstream.
社団法人プラズマ・核融合学会の論文
1996-07-25