セラミックスのレーザ照射による除去機構 : 高パワー密度レーザによる材料加工の研究(第2報)

概要

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In CO_2 laser cutting Si_3N_4 and Al_2O_3 ceramics, temperature distribution was measured at various cutting speeds, assist gas pressures and laser powers, and cutting mechanism was discussed. Results obtained are summarized as follows ;(a) At given cutting speed, the temperature at cutting front was constant from top to bottom surface. The temperature increased with increasing cutting speed, and was independent of laser power and assist gas pressure.(b) From the slope of an Arrhenius plot, an activation energy was found to agree well with bond energy of Si-N and Al-O for Si_3N_4 and Al_2O_3,respectively, which shows that cutting speed is dominated by thermal decomposition rate of ceramics.(c) High pressure N_2 gas due to decomposition of Si_3N_4 blew the liquid Si layer off.
社団法人溶接学会の論文
1992-08-05