液相インサート金属拡散接合における等温凝固過程の解析 : Ni基超耐熱鋳造合金の液相インサート金属拡散接合に関する研究(第2報)

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In this report, isothermal solidification process on transient liquid phase insert metal diffusion bonding of Ni-B binary system and Ni-P binary system was investigated. From experimental results on the isothermal solidification process, it was clarified that this process was controlled by the diffusional process of B and P in the base metal. The activation energy Q and frequency factor Do for diffusion of B and P in Ni obtained were as follows Bin Ni : Q=226 kJ/mol, Do=0.14 m^2/s P in Ni : Q=284 kJ/mol, Do=0.49 m^2/s The complete time of the process can be estimated by equation (1) and (2) Ni-B system : [numerical formula] Ni-P system : [numerical formula] The isothermal solidification process on Ni base superalloy joints were also examined. The isothermal solidification process of MM-007,MarM-247,Inconel-713C and Inconel-600 joints with using Ni-15.5% Cr-3.7% B insert metal can be also interpreted by the same theoretical equation applied to the process of Ni-B system.
1989-05-05