Cu基インサート金属によるSi_3N_4と金属の接合性に関する基礎的検討 : 耐熱性ファインセラミックスの接合に関する研究(第3報)

概要

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Bonding of Si_3N_4 to metal using liquid insert metals of Cu-base binary alloys containing Cr, Nb, V, Ti or Zr was conducted in vacuum of about 6 mPa. Joint strength was evaluated by tensile-shear tests. The heighest strength of Si_3N_4 to W joints bonded using Cu-5%Cr, Cu-1%Nb, Cu-3%V, Cu-5%Ti and Cu-10%Zr insert metals were about 150 MPa, 140 MPa, 140 MPa, 180 MPa and 180 MPa, respectively. Effect of bonding conditions on area fraction of void in Si_3N_4 to W joints was investigated. Area fraction of void increased with increasing bonding temperature and holding time. It was considered that formation of void was mainly caused by outflow or vaporization of insert metal.
社団法人溶接学会の論文
1989-02-05