A6061とプリコート金属の共晶反応によるA6061界面反応性向上 : アルミニウム合金とステンレス鋼の拡散接合に関する研究(第4報)

概要

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In order to clarify the interfacial reactivity between A6061 and pre-coated metals in surface-activated pre-coating technique, the bond interface of diffusion-bonded joints of A6061 to Ag, Cu or Ni was analyzed. Diffusion bonding of A6061/Ag, Cu or Ni was carried out at 660-723K for 0-3.6ks applying 9.8MPa in vacuum. Eutectic temperature of A6061-Ag, Cu or Ni alloy was measured preliminarily by DTA technique. The lowest eutectic temperatures of A6061-Ag, A6061-Cu and A6061-Ni systems were 680±10K, 700±10K and 720±10K, respectively. SEM observation revealed that the reaction layer was formed at the bond interface. The Ag-Al, Cu-Al and Ni-Al intermetallic compounds were identified in the reaction layer. It was elucidated that the reaction layer growth could be expressed by parabolic growth law, and that the incubation time for reaction layer formation was increased in the order of Ag<Cu<Ni. The reaction layer formation at A6061/Ag, A6061/Cu and A6061/Ni interfaces were much promoted to that in A6061/SUS316 interface. A use of pre-coated metal as an insert metal could improve the interfacial reactivity (diffusion-bondability) of A6061/SUS316 joint by breaking the oxide film on A6061 due to the eutectic reaction between A6061 and pre-coated metal.
社団法人溶接学会の論文
2005-08-05