Improvement of Refresh Characteristics by SIMOX Technology for Giga-bit DRAMs (Special Issue on ULSI Memory Technology)
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概要
- 論文の詳細を見る
Stacked capacitor dynamic random access memory (DRAM) cells with both NMOS and PMOS cell transistors (Lg=0.4 μm) were fabricated on ultra-thin SIMOX (separation by implantation of oxygen) substrates, and the data retention time was compared with that of a bulk counterpart. A data retention time of 550 sec (at 25℃) could be achieved using ultra-thin SIMOX substrates, which is 6 times longer than that using the bulk substrate. A stacked capacitor cell with a PMOS cell transistor on an ultra-thin SIM0X substrate is very attractive and promising for future giga-bit DRAM cells.
- 社団法人電子情報通信学会の論文
- 1996-06-25
著者
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Koga H
Kyushu Inst. Technol. Iizuka‐shi Jpn
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TANIGAWA Takaho
ULSI Device Development Laboratories NEC Corporation
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Tanigawa Takaho
Faculty Of Engineering Science Osaka University
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YOSHINO Akira
ULSI Device Development Laboratories, NEC Corporation
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KOGA Hiroki
ULSI Device Development Laboratories, NEC Corporation
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OHYA Shuichi
ULSI Device Development Laboratories, NEC Corporation
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Ohya Shuichi
Ulsi Device Development Laboratories Nec Corporation
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Koga Hiroki
Ulsi Device Development Division:(present Address)sony Corporation
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Yoshino Akira
Ulsi Device Development Laboratories Nec Corporation
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- Improvement of Refresh Characteristics by SIMOX Technology for Giga-bit DRAMs (Special Issue on ULSI Memory Technology)
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