LSIパッケージ搭載用ピンフィン形ヒートシンクの噴流冷却における熱抵抗の簡易予測法

概要

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This paper describes a semi-empirical study on the development of a prediction algorithm of thermal resistance in the case of pin-fin heat sinks for LSI packages using impingement cooling. The inlet orifice was relatively large and was placed above the center of the heat sink. A physical model suitable for heat sinks with pin-fin arrays was considered based on flow visualization results. According to this model, the flow field was divided into five sections : (i) the top of the fin beneath the inlet orifice, (ii) the region under the inlet orifice, where the flow was parallel to the pin-fins, (iii) the fin base area, (iv) the region where the flow was perpendicular to the pin-fins excluding the region covered the bottom of the inlet orifice, (v) the top of the fin, except the region under the inlet orifice. Among them, heat transfer in the parts (i), (iii) and (v) was found to be neglective small, and it was not considered here. Thermal resistance values of the heat sink with pin-fin arrays were predicted for a variety of orifice diameters, gaps, pin-fin diameters, pin-fin heights and number of pin-fins. These values agree with the experimental data to within ±30% error.
一般社団法人日本機械学会の論文
1996-03-25