LSIパッケージ搭載用ピンフィン形ヒートシンクの噴流冷却特性に関する実験的検討

概要

論文の詳細を見る
This paper describes an experimental study of impingement cooling characterisitics of heat sinks with pin-fin arrays. The experiments are performed with a variety of pin-fin arrays. For enhancing impingement cooling, one inlet orifice over the center of the heat sink is found to be the best geometric structure. The optimum orifice diameter is about 1/3 of the heat sink width. The optimum pin-fin diameter is about 0.5 mm for low blower power, and increases to 1.0 mm as the blower power increases. When the pin-fin diameter and the pin-fin number are constant, the heat transfer rate increases with increasing pin-fin height, but becomes almost constant when the pin-fin height is 10 mm or more. If the heat sink area or the pin-fin number is constant, the heat transfer rate reaches an optimum value when the ratio of the pin pitch to the pin-fin diameter reaches approximately 2〜2.5. By increasing the total surface area of the heat sink, the heat transfer rate per unit blower power increases, with a maximum value of about 5 to 6 times the fin base heat transfer rate without a heat sink.
一般社団法人日本機械学会の論文
1995-02-25