SIMPLE法べースの有限要素法によるLSIパッケージの三次元定常熱流動解析

概要

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A finite element procedure based on the SIMPLE algorithm is presented for the solution of steady-state Navier-Stokes equations for three-dimensional forced convection. The finite element formulation for pressure correction is derived from the discretized continuity equation. The computational results obtained by the procedure reveal reasonable accuracy with rather small computation time for a converged steady-state solution than by the unsteady method. By using this procedure the parametric study of cooling of a LSI module on a double-sided card is performed. The effects of thermal resistance of a multilayer circuit board on the temperature distribution of LSI module are intensively examined. It is found that the thermal leak through the circuit board cannot be ignored for memories on multilayer double-sided cards, on the other hand, it can be ignored for those on single-layer double-sided cards.
一般社団法人日本機械学会の論文
1994-10-25