内周刃ブレードによる高精度スライシング加工に関する研究 : 研削抵抗の理論式とブレード面内方向の断面力

概要

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We derive the theoretical formula for grinding force acting on an ID-blade. and analyze the in-plane force and in-plane displacement of the D-blade. The results are summarized as follows. (1) The specific grinding force of 2 400 N/mm^2 was obtained for single crystal silicon using the theoretical formula for grinding force. (2) The in-plane normal force S_<Iθ> caused by the tensioning operation is almost uniformly distributed in the electroplated part of the ID-blade. (3) Where t_A and t_B denote the thicknesses of the electroplated part and the steel base respectively, S_<Iθ> in the electroplated part is about t_A/t_B times greater than in the steel base at their boundary. (4) In-plane forces caused by both centrifugal force and grinding force are extremely small compared with the maximum value of S_<Iθ>. (5) The in-plane displacement caused by grinding force is strongly affected by the diameters of the work and ID-blades.
社団法人日本機械学会の論文
1997-10-25