単結晶シリコンの延性モード鏡面切削(第1報) : 切削モードの遷移挙動に及ぼす切削速度の影響

概要

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The purpose of this study is to make clear the influence of cutting speed on the transition behavior from brittle to ductile mode in the cutting process of single-crystal silicon using a single point diamond tool. The main results obtained in this study are summarized as follows : (1) When the feed rate falls below a critical value f_c at a constant cutting speed and a constant tool depth of cut, the brittle/ductile mode transition phenomenon takes place. The critical feed rate f_c increases with an increase of the cutting speed. (2) The critical depth of cut d_c at which the brittle/ductile mode transition phenomenon occurs increases with an increase of the cutting speed and it is hardly affected by the feed rate. (3) Mirror surfaces with roughness of 15-30 nm Ry can be generated by optimizing the feed rate and the cutting speed.
社団法人精密工学会の論文
1998-04-05