銅の半田ろう接に関する研究

概要

論文の詳細を見る
The forming of diffusion layer has been said to be the principal joining mechanism of sordering. In this work solders of four different composition are studied, 60% Sn-40% Pb, 70% Sn-30% Pb, 60% Sn-39% Pb-1% Sb, and 60% Sn-38% Pb-2% Sb. Copper plates are immersed in the melt of these solders in the temperature range 250℃ to 450℃ for 30 sec to 3600 sec, and the thickness of diffusion layer, the change in copper plate thickness and hardness are measured. The observation of the diffusion layer and the analysis of metallic elements with X-ray microanalyser are also reported. The result shows that the diffusion layer consists of Sn rich Sn-Cu alloy which dissolves into the solder phase.
湘南工科大学の論文
1973-03-31