黄銅の半田ろう接に関する研究

概要

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The forming of a diffusion layer has been said to be the principal joining mechanism of soldering. In this work solders of four different compositions are studied, 60%Sn-40%Pb, 70%Sn-30%Pb, 60%Sn-39%Pb-1%Sb, and 60%Sn-38%Pb-2%Sb. Brass plates are immersed in the melt of these solders in temperatures ranging 250℃ to 450℃ for 30 sec to 3600 sec, and the thickness of the diffusion layer, and the change in hardness are measured. The observation of the diffusion layer and the analysis of metallic elements with an X-ray microanalyser are also reported. The results show that all four solders react with the brass and produce an apparent diffusion layer. The diffusion layer was produced by the formation of Cu-Sn-Zn reaction.
1977-03-31