Cu-Zn 合金の半田ろう接による拡散層に及ぼす Zn の影響について

概要

論文の詳細を見る
An investigation was made to study the reaction in the case of heating up 60% Sn-40% Pb solder and Cu-Zn alloy plate. Soldering and Cu-Zn alloy are heated in temperatures ranging from 225 to 450℃ for 30 to 1200sec and the spread condition of solder, the thickness of the diffusion layer, the change in Cu-Zn alloy thickness and hardness are measured. The observation of the diffusion layer and the analysis of metallic elements with X-ray microanalyser are also reported. The results show that Sn-Pb solder reacts with the Cu-Zn alloys and produces apparent dissolution. Dissolution was produced by the formation of Cu-Sn-Zn reaction products which tended to break away from the Cu-Zn alloy/solder interface and drift into the solder. At least under some conditions the reaction product is ε(Cu_3Sn) or η(Cu_6Sn_5) type phases. Formation of the reaction product is accompanied by the diffusion of Tin into Cu-Zn alloy and the apparent outward diffuson of copper and zinc into solder.
湘南工科大学の論文
1979-03-31