Fabrication of Metallic Nanopatterns Using the Vacuum Type UV-NIL Equipment
スポンサーリンク
概要
- 論文の詳細を見る
- 2007-05-01
著者
-
Mizuno Jun
Nanotechnology Research Laboratory, Waseda University
-
Shoji Shuichi
Waseda Univ. Tokyo Jpn
-
Shoji Shuichi
School Of Fundamental Science And Engineering Waseda University
-
Shoji Shuichi
Department Of Science And Engineering Waseda University
-
Mizuno Jun
Nanotechnology Research Laboratory Waseda University
-
Mizuno Jun
Department Of Science And Engineering Waseda University
-
Homma Takayuki
Waseda University
-
Mizuno Jun
Waseda Univ. Tokyo Jpn
-
SAITO Mikiko
Department of Science and Engineering, Waseda University
-
FUKUHARA Makoto
Waseda University
-
SAITO Mikiko
Waseda University
-
Saito Mikiko
Department Of Science And Engineering Waseda University
-
Shoji Shuichi
Waseda Univ. Dept. Of Electrical Engineering And Bioscience School Of Science & Technology
-
Homma Takayuki
Waseda Univ. Tokyo Jpn
関連論文
- Au-electrode-embedded cyclo-olefin polymer microchip using low-temperature direct bonding (特集 マイクロ加工および支援技術)
- Fabrication of a microchannel device by hot embossing and direct bonding of poly (methyl methacrylate)
- Au-Electrode-Embedded Cyclo-Olefin Polymer Microchip Using Low-Temperature Direct Bonding
- Low-temperature Direct Bonding of Poly(methyl methacrylate) for Polymer Microchips
- Temperature Compensated Piezoresistor Fabricated by High Energy Ion Implantation
- Simplified 20-μm Pitch Vertical Interconnection Process for 3D Chip Stacking
- Fabrication of Metallic Nanopatterns Using the Vacuum Type UV-NIL Equipment
- 2TA5-07 マイクロ流体デバイスを用いた8並列型ソーター(バイオエンジニアリング,第47回日本生物物理学会年会)
- Fabrication of High Light-Extraction Efficiency LED Using Nanostructures by UV Nanoimprint Lithography and Electrodeposition
- High Sensitive X-ray Microcalorimeter Using Bi-Au Microabsorber for Imaging Applications
- Single Grain and Single Grain Boundary Resistance of Pentacene Thin Film Characterized by Nano-scale Electrode Array
- Micromechanical Characterization of Self-Oscillating Microcantilever Using Piezoresistive Microsensors
- Development of Perpendicular Magnetic Recording Media for High Density Recording
- Development of a Sub-micron Processing Method with Ion Implantation
- Fabrication of Polymer and Metal Three-Dimensional Micromesh Structures
- An Experimental Study on Relative Displacement Sensing Using Phototransistor Array for Building Structures
- Development of Lateral Displacement Sensor for Real-Time Detection of Structural Damage
- Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles
- 次亜リン酸の酸化反応に対する金属表面の触媒活性の理論的解析