Electric Flame-Off Characteristics and Fracture Properties of 20μm Thin Copper Bonding Wire
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2009-02-01
著者
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Hung Fei-yi
Institute Of Nanotechnology And Microsystems Engineering Center For Micro/nano Science And Technolog
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Lui Truan-sheng
Department Of Materials Science And Engineering National Cheng Kung University
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CHEN Li-Hui
Department of Materials Science and Engineering, National Cheng Kung University
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Chen Li-hui
Department Of Materials Science And Engineering National Cheng Kung University
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Lui Truan‐sheng
Department Of Materials Science And Engineering National Cheng Kung University
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Lui T‐s
National Cheng Kung Univ. Tainan Twn
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Chen Li‐hui
Department Of Materials Science And Engineering National Cheng Kung University
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Chen L‐h
National Cheng Kung Univ. Tainan Twn
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LIN Yi-Chang
Department of Materials Science and Engineering, National Cheng Kung University
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Hung Fei-yi
Department Of Material Science And Engineering National Cheng Kung University
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Lin Yi-chang
Department Of Materials Science And Engineering National Cheng Kung University
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Chen Li‐hui
Dep. Of Materials Sci. And Engineering National Cheng Kung Univ.
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Lui Truan-sheng
Department Of Material Science And Engineering National Cheng Kung University
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Chen Li-hui
Dep. Of Materials Sci. And Engineering National Cheng Kung Univ.
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Hung Fei-yi
Institute Of Nanotechnology And Microsystems Engineering Center For Micro/nano Science And Technolog
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Hung Fei-yi
Inst. Of Nanotechnology And Microsystems Engineering National Cheng Kung Univ.
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Lin Yi-Chang
Department of Electronic Engineering, Ching Yun University, Jhongli 32097, Taiwan
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