クエン酸を含有する浴からのCu-In合金の電析

概要

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Electrodeposition of copper, indium and their alloy on titanium substrate from the solution containing citric acid were studied where the effects of copper and citric acid concentrations on the alloy deposition behavior were examined. The polarization curve for either copper or indium shows that, when citric acid is added to the solution, the metal deposition potential becomes less noble and the limiting current density decreases. In the alloy depositon, with the decrease in the copper concentration, the indium deposition potential becomes less noble and the limiting current density decreases. The deposition condition of the stoichiometric alloy, CuIn, depends on the citric acid and copper concentrations as well as the current density. Calculation of ionic equilibria in the solution shows that the formation of CuCit - ion decreases Cu ion concentration and its limiting current density, which explains the experimental result.
社団法人資源・素材学会の論文
2000-03-25